The rapid expansion of AI data centres, the increasing prevalence of electric vehicles and the ongoing trends towards global digitalisation and reindustrialisation will lead to a sharp rise in global electricity demand. To meet this challenge, Infineon Technologies is expanding its growing gallium nitride (GaN) portfolio with EasyPACK™ modules. The CoolGaN™ modules are based on the EasyPACK module platform and have been specially developed for high-performance applications such as data centres, renewable energy systems and charging units for electric vehicles. The modules support the growing demand for higher performance in reduced space while offering high process reliability in automatic assembly. In addition, Infineon offers customised EasyPACK modules that enable customers to optimally adapt the modules to their designs and significantly reduce the time to market for customer designs.
‘The CoolGaN-based EasyPACK power modules combine Infineon’s expertise in power semiconductors and power modules,’ said Roland Ott, Senior Vice President and Head of the Green Energy Modules and Systems business unit at Infineon. ‘This combination offers customers a solution to meet the growing demand for powerful and energy-efficient technologies in applications such as data centres, renewable energy and EV charging stations.’
The EasyPACK CoolGaN module integrates 650 V CoolGaN power semiconductors with low parasitic inductances, which are achieved through a compact chip layout and enable fast and efficient switching. With a power rating of up to 70 kW per phase with just a single module, the design supports compact and scalable high-performance systems. By combining Infineon’s .XT technology, the module also increases both performance and reliability. The .XT technology combined with a high-performance substrate significantly increases system efficiency, resulting in reduced cooling requirements. This achieves higher power density and excellent thermal transient performance even under demanding operating conditions. The EasyPACK CoolGaN module supports a wide range of topologies and customisation options, meeting the most diverse requirements in industrial, automotive and energy applications.
About EasyPACK
Infineon has sold well over 70 million EasyPACK modules with various chip sets for a wide range of industrial and automotive applications. With the introduction of CoolGaN power semiconductors in EasyPACK modules, Infineon is now expanding the application range of GaN power semiconductors and thus supporting growing power requirements with the same or less space. The EasyPACK series uses Infineon’s PressFIT contact technology, which enables highly reliable and long-lasting electrical connections between the module and the PCB. Using a cold welding process, PressFIT delivers gas-tight, solder-free connections that offer long-term mechanical stability and electrical conductivity even under demanding thermal and mechanical conditions. This advanced design reduces manufacturing time and eliminates potential solder-related failures, resulting in a robust solution for high-reliability applications. Compared to traditional discrete layouts, EasyPACK modules require up to 30 percent less space on the PCB due to their compact design, resulting in an extremely cost-effective solution.
About CoolGaN 650 V G5 power semiconductors
The latest 650 V CoolGaN generation offers improved performance and better characteristics. Infineon’s benchmark data shows that CoolGaN power semiconductors in the 650 V G5 product range store up to 50 percent less energy in the output capacity (E oss), have up to 60 percent improved drain-source charge (Q oss) and up to 60 percent lower gate charge (Q g). Together, these features result in higher efficiency in both hard and soft switching applications. This significantly reduces power loss compared to conventional silicon technology, by 20 to 60 percent depending on the application. The CoolGaN Transistor 650 V G5 product family offers a wide range of R DS(on) package combinations. Ten R DS(on) classes are available in various SMD packages, including ThinPAK 5×6, DFN 8×8, TOLL and TOLT. All products are manufactured on high-performance 8-inch production lines in Villach (Austria) and Kulim (Malaysia). Target applications range from switching power supplies (SMPS) for consumer electronics and industrial applications, such as USB-C adapters and chargers, lighting, TV, data centres and telecommunications rectifiers, to renewable energy and motor drives in household appliances.
Availability
Infineon will showcase the EasyPACK modules with CoolGaN at PCIM 2025 in Nuremberg at the Infineon booth in Hall 7, Booth 470. Further information is available here.
Infineon at PCIM Europe 2025
PCIM Europe will take place from 6 to 8 May 2025 in Nuremberg. Infineon will showcase its products and solutions for decarbonisation and digitalisation in Hall 7, Stand 470. Representatives of the company will also give several presentations on the stages of the PCIM Expo and the accompanying PCIM Conference, followed by discussions with the speakers. Those interested in speaking with experts can make an appointment at media.relations@infineon.com. Industry analysts can contact MarketResearch.Relations@infineon.com. Information about Infineon’s highlights at PCIM 2025 is available at www.infineon.com/pcim.
