With the AS-DT1, Sony is expanding its range of compact 3D sensors for autonomous and automated systems. The LiDAR depth sensor combines direct time-of-flight technology with SPAD sensor technology, achieves indoor measurement ranges of up to 40 metres and delivers depth data directly as a point cloud. MaxxVision is now adding the solution to its industrial image processing portfolio.

With the increasing automation of production, logistics and mobile platforms, there is a growing need for sensors that can not only map their surroundings in two dimensions, but also capture them spatially. Autonomous mobile robots must determine distances to obstacles, drones require information about their surroundings, and in industrial facilities, three-dimensional data is increasingly being used for positioning, navigation and object localisation.

This is precisely where the Sony AS-DT1 comes in. The Stuttgart-based image processing distributor MaxxVision is expanding its portfolio with this compact 3D LiDAR depth sensor, which is specifically designed for applications with limited installation space and weight constraints. Measuring just 29 × 29 × 31 millimetres and weighing around 46 grams, the sensor can also be integrated into smaller mobile platforms and embedded systems.

dToF and SPAD as the technological basis

The AS-DT1 uses the Direct-Time-of-Flight (dToF) method for distance measurement. This involves emitting laser pulses and measuring the time taken by the reflected light to travel to the object and back to the sensor. The distance can be determined from this transit time.

A SPAD sensor – Single-Photon Avalanche Diode – is used as the receiving element. SPAD detectors can detect individual photons and are therefore particularly suitable for highly sensitive time-of-flight measurements.

Depending on the operating mode, the AS-DT1 captures up to 576 measurement points in a 24 × 24 array. The horizontal field of view is 35.5 degrees ±2 degrees, whilst the vertical field of view covers 28.2 degrees ±2 degrees. Sony specifies the distance resolution as 0.25 millimetres.

The captured distance information can be output both as a point cloud and as Z-axis data. In addition, the sensor provides an intensity image in UVC-YUV2 format. This means that spatial information is immediately available for downstream processing.

This opens up applications such as obstacle detection, navigation, distance measurement and three-dimensional object detection.

Range of up to 40 metres

Depending on the operating mode, the usable measuring range extends from 0.3 to 40 metres. Indoors, the AS-DT1 can measure distances of up to 40 metres.

Also noteworthy is the specified performance under high ambient light conditions. Under the measurement conditions defined by Sony, the sensor achieves ranges of up to 20 metres outdoors at an illuminance of up to 100,000 lux.

This means the technology is not limited solely to traditional indoor applications. Mobile robots, inspection platforms or UAVs that operate outdoors, at least occasionally, can also benefit from 3D depth sensing.

Depending on the measurement mode, frame rates of up to 30 frames per second are possible. The sensor can therefore also capture continuously changing scenes and provides a vital foundation for systems that need to react to movements or changing distances.

Compact design for AMRs, AGVs and drones

The physical size of a sensor is a crucial factor, particularly for mobile platforms. In autonomous mobile robots, automated guided vehicles (AGVs) or unmanned aerial vehicles (UAVs), sensors, processing units, power supplies and mechanical components must be integrated into a very confined space.

Measuring 29 × 29 × 31 millimetres, the AS-DT1 takes up very little installation space. At the same time, the additional payload remains low at around 46 grams. This broadens the range of applications, particularly for AMRs, AGVs, service robots, drones and mobile inspection systems.

Sony uses VCSEL laser diodes with a wavelength of 940 ±6 nanometres as the light source. The AS-DT1 is specified as a Class 1 laser product in accordance with IEC/EN 60825-1:2014, Edition 3.

Integration via USB, UART and trigger signals

For industrial applications, sensor performance is not the only deciding factor. Integration into existing control, embedded and processing systems is equally important.

To this end, the AS-DT1 features USB 3.2 Gen1, USB 2.0 and UART, as well as additional trigger and time-synchronisation signals.

The connection to the host system is made via a USB Type-C UFP connector. In addition, a USB Type-C DFP port with an integrated USB hub is available.

An eight-pin JST-GH connector also provides UART communication, Trigger IN and OUT, as well as TS CLK and TS PRESET. This allows the sensor to be integrated into applications where multiple sensors or external systems need to be synchronised.

Power can be supplied either via USB Type-C at 5 volts or via the JST-GH connector at 12 to 24 volts. The maximum power consumption is just 2.5 watts – a significant factor, particularly for battery-powered mobile platforms.

Up to four sensors in a daisy chain

For applications where a single field of view is insufficient, the AS-DT1 supports the configuration of multi-sensor systems. Via USB Type-C with Power-over-USB, up to four sensors can be connected in a daisy chain.

This allows multiple viewing directions to be covered simultaneously. In the case of an autonomous transport vehicle, for example, each sensor could monitor different areas of the platform. Even in stationary automation systems, multiple measurement ranges can be realised using a daisy-chained sensor configuration.

This approach is particularly useful where full, high-resolution all-round coverage is not required, but where several defined fields of view need to be reliably monitored.

SDK for Windows, Linux and embedded computing

For software integration, Sony provides a Software Development Kit with a sample programme and Python library.

Supported platforms include Windows 11 (64-bit version), Ubuntu 24.04, Nvidia Jetson Orin AGX with JetPack 6.2.1, and Raspberry Pi OS as of 1 October 2025.

The platform thus covers both traditional industrial PC systems and compact edge and embedded computers. This is particularly relevant for robotics and machine vision applications, as the depth data obtained can be combined directly with navigation algorithms, object recognition or other image processing techniques.

Compact 3D perception rather than maximum point density

With up to 576 measurement points, the AS-DT1 takes a different approach to high-resolution LiDAR systems, which map their surroundings using tens of thousands or millions of measurement points. Its strength lies not so much in maximum point density as in the combination of compact size, low weight, low power consumption and directly available depth data.

For many industrial applications, this distinction is crucial. When it comes to collision avoidance for a mobile robot, distance monitoring or the detection of a clearly defined machine area, a high-resolution 3D map is not necessarily required. What may be crucial, rather, is that relevant distances are available quickly, reproducibly and with as little hardware overhead as possible.

The AS-DT1 thus positions itself as a compact sensor module bridging the gap between simple distance measurement and complex, high-resolution LiDAR systems.

3D sensor technology is becoming key to autonomous systems

As autonomy increases, the importance of reliable spatial perception grows. Whilst conventional cameras provide high-resolution visual information, distance data often has to be derived from this using algorithms. LiDAR systems, by contrast, provide geometric depth information directly.

In many applications, therefore, different sensor principles will be combined in future: cameras capture colour, texture and object features, whilst depth sensors provide additional spatial information.

The Sony AS-DT1 addresses precisely this need in a particularly compact form. It thus provides a further building block for three-dimensional perception for autonomous mobile robots, automated guided vehicles, service robotics, UAVs and drones, mobile inspection systems, as well as machine vision, logistics and automation applications.

Its real strength lies not in any single outstanding specification, but in the interplay of dToF and SPAD technology, range, compact design, low power consumption, direct point cloud output and flexible system integration. Particularly in applications where 3D sensors need to take up as little space and weigh as little as possible, this could significantly simplify the implementation of spatial environment sensing.

Further information on the Sony AS-DT1: www.maxxvision.com/produkte/3d-imaging/lidar-sensoren/3417/as-dt1